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| FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode December 2006 FDFMA2N028Z 20V, 3.7A, 68m Features MOSFET Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode General Description This device is designed specifically as a single package solution for a boost topology in cellular handset and other ultra-portable applications. It features a MOSFET with low on-state resistance, and an independently connected schottky diode with low forward voltage. The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to switching and linear mode applications. Max rDS(on) = 68m at VGS = 4.5V, ID = 3.7A Max rDS(on) = 86m at VGS = 2.5V, ID = 3.3A Schottky VF < 0.37V @ 500mA Low profile - 0.8 mm maximum - in the new package MicroFET 2x2 mm RoHS Compliant Application DC - DC Conversion Pin 1 A NC D A1 NC 2 D3 C MicroFET 2X2 G S 6C 5G 4S MOSFET Maximum Ratings TJ = 25C unless otherwise noted Symbol VDS VGS ID PD TJ, TSTG VRR IO Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous -Pulsed Power Dissipation Power Dissipation Operating and Storage Junction Temperature Range Schottky Repetitive Peak Reverse Voltage Schottky Average Forward Current (Note 1a) (Note 1b) (Note 1a) Ratings 20 12 3.7 6 1.4 0.7 -55 to +150 20 2 Units V V A W C V A Thermal Characteristics RJA RJA RJA RJA Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Ambient (Note 1a) (Note 1b) (Note 1c) (Note 1d) 86 173 86 140 C/W Package Marking and Ordering Information Device Marking .N28 Device FDFMA2N028Z Package MicroFET 2X2 1 Reel Size 7'' Tape Width 8mm Quantity 3000 units www.fairchildsemi.com (c)2006 Fairchild Semiconductor Corporation FDFMA2N028Z Rev.B FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode Electrical Characteristics TJ = 25C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS BVDSS TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250A, VGS = 0V ID = 250A, referenced to 25C VDS = 16V, VGS = 0V VGS = 12V, VDS = 0V 20 15 1 10 V mV/C A A On Characteristics VGS(th) VGS(th) TJ rDS(on) gFS Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient Static Drain to Source On Resistance Forward Trans conductance VGS = VDS, ID = 250A ID = 250A, referenced to 25C VGS = 4.5V, ID = 3.7A VGS = 2.5V, ID = 3.3A VGS = 4.5V, ID = 3.7A, TJ = 125C VDS = 10V, ID = 3.7A 0.6 1.0 -4 37 50 53 16 68 86 90 S m 1.5 V mV/C Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 10V, VGS = 0V, f = 1.0MHz 340 80 60 455 110 90 pF pF pF Switching Characteristics td(on) tr td(off) tf Qg(TOT) Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge VDS = 10V ID = 3.7A VGS = 4.5V VDD = 10V, ID = 1A VGS = 4.5V, RGEN = 6 8 8 14 3 4 0.7 1.1 16 16 26 6 6 ns ns ns ns nC nC nC Drain-Source Diode Characteristics IS VSD trr Qrr Maximum Continuous Drain-Source Diode Forward Current Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 1.1A (Note 2) 0.7 11 2 1.1 1.2 A V ns nC IF = 3.7A, di/dt = 100A/s Schottky Diode Characteristics VR IR Reverse Voltage Reverse Leakage IR = 1mA VR = 20V IF = 500mA VF Forward Voltage IF = 1A TJ = 25C TJ = 25C TJ = 125C TJ = 25C TJ = 125C TJ = 25C TJ = 125C 20 30 10 0.32 0.21 0.37 0.28 300 45 0.37 0.26 0.435 0.33 V V A mA FDFMA2N028Z Rev.B 2 www.fairchildsemi.com FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode Electrical Characteristics TJ = 25C unless otherwise noted Notes: 1: RJA is determined with the device mounted on a 1in2 pad 2 oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. RJC is guaranteed by design while RJA is determined by the user's board design. (a) MOSFET RJA = 86oC/W when mounted on a 1in2 pad of 2 oz copper, 1.5" x 1.5" x 0.062" thick PCB. (b) MOSFET RJA = 173oC/W when mounted on a minimum pad of 2 oz copper. (c) Schottky RJA = 86oC/W when mounted on a 1in2 pad of 2 oz copper, 1.5" x 1.5" x 0.062" thick PCB. (d) Schottky RJA = 140oC/W when mounted on a minimum pad of 2 oz copper. a)86oC/W when mounted on a 1in2 pad of 2 oz copper. b)173oC/W when mounted on a minimum pad of 2 oz copper. c)86oC/W when mounted on a 1in2 pad of 2 oz copper. d)140oC/W when mounted on a minimum pad of 2 oz copper. 2: Pulse Test: Pulse Width < 300s, Duty cycle < 2.0%. FDFMA2N028Z Rev.B 3 www.fairchildsemi.com FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode Typical Characteristics TJ = 25C unless otherwise noted 6 5 ID, DRAIN CURRENT (A) NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 2.0 VGS = 2.0V 1.8 1.6 1.4 1.2 1.0 0.8 PULSE DURATION = 300s DUTY CYCLE =2%MAX 4 3 2 1 0 0.0 VGS = 4.5V VGS = 3.0V VGS = 2.5V VGS = 2.0V PULSE DURATION = 300s DUTY CYCLE = 2%MAX VGS = 1.5V VGS = 2.5V VGS = 3.0V VGS = 3.5V VGS = 4.5V 0.2 0.4 0.6 0.8 1.0 VDS, DRAIN TO SOURCE VOLTAGE (V) 1.2 0 1 2 3 4 ID, DRAIN CURRENT(A) 5 6 Figure 1. On-Region Characteristics Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage 150 rDS(on), DRAIN TO SOURCE ON-RESISTANCE (m) ID = 1.85A NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 1.6 1.4 1.2 1.0 0.8 0.6 -50 ID = 3.7A VGS = 4.5V 125 100 75 50 25 TJ = 25oC PULSE DURATION = 300s DUTY CYCLE = 2%MAX TJ = 125oC -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (oC) 150 0 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10 Figure 3. Normalized On- Resistance vs Junction Temperature IS, REVERSE DRAIN CURRENT (A) Figure 4. On-Resistance vs Gate to Source Voltage 10 VGS = 0V 6 5 4 3 2 1 0 0.5 TJ = -55oC TJ = 125oC PULSE DURATION = 300s DUTY CYCLE = 2%MAX VDD=5V ID, DRAIN CURRENT (A) 1 0.1 TJ = 125oC TJ = 25oC 0.01 0.001 TJ = 25oC TJ = -55oC 1.0 1.5 2.0 VGS, GATE TO SOURCE VOLTAGE (V) 2.5 0.0001 0.0 0.2 0.4 0.6 0.8 1.0 VSD, BODY DIODE FORWARD VOLTAGE (V) 1.2 Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode Forward Voltage vs Source Current FDFMA2N028Z Rev.B 4 www.fairchildsemi.com FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode Typical Characteristics TJ = 25C unless otherwise noted VGS, GATE TO SOURCE VOLTAGE(V) 10 ID = 3.7A 1000 Ciss 8 6 4 2 0 VDD = 5V VDD = 15V CAPACITANCE (pF) Coss 100 Crss f = 1MHz VGS = 0V VDD = 10V 0 2 4 6 Qg, GATE CHARGE(nC) 8 10 10 0.1 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 20 Figure 7. Gate Charge Characteristics P(PK), PEAK TRANSIENT POWER (W) 20 10 Figure 8. Capacitance Characteristics 50 40 30 20 10 0 -4 10 SINGLE PULSE SINGLE PULSE o RJA = 173 C/W TA=25 C o rDS(on) LIMIT ID, DRAIN CURRENT (A) 100us 1ms 10ms 1 0.1 VGS=4.5V SINGLE PULSE R JA =173 o 100ms C/W TA = 25 C o 1s 10s DC 0.01 0.1 1 10 60 10 -3 VDS, DRAIN to SOURCE VOLTAGE (V) 10 10 10 10 t, PULSE WIDTH (s) -2 -1 0 1 10 2 10 3 Figure 9. Forward Bias Safe Operating Area IR, REVERSE LEAKAGE CURRENT (mA) Figure 10. Single Pulse Maximum Power Dissipation 100 TJ = 125oC 10 IF, FORWARD CURRENT(A) TJ = 125oC 1 10 1 0.1 0.01 0.001 0.1 TJ = 85oC TJ = 85oC 0.01 TJ = 25oC TJ = 25oC 0.001 0 200 400 600 VF, FORWARD VOLTAGE(mV) 800 0 5 10 15 20 VR, REVERSE VOLTAGE (V) 25 30 Figure 11. Schottky Diode Forward Current Figure 12. Schottky Diode Reverse Current FDFMA2N028Z Rev.B 5 www.fairchildsemi.com FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode Typical Characteristics TJ = 25C unless otherwise noted 2 1 NORMALIZED THERMAL IMPEDANCE, ZJA DUTY CYCLE-DESCENDING ORDER 0.1 D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 SINGLE PULSE t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA 0.01 0.005 -4 10 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 t, RECTANGULAR PULSE DURATION (s) Figure 13. Transient Thermal Response Curve FDFMA2N028Z Rev.B 6 www.fairchildsemi.com FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode FDFMA2N028Z Rev.B 7 www.fairchildsemi.com FDFMA2N028Z Integrated N-Channel PowerTrench(R) MOSFET and Schottky Diode TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACT(R) FAST(R) FASTrTM FPSTM FRFETTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHC(R) UniFETTM VCXTM WireTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production Rev. I22 FDFMA2N028Z Rev. B 8 www.fairchildsemi.com |
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